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Wednesday, 25 January 2023
Thursday, 25 November 2021
sico smartphone mega flash file Cm2 Read Firmware
Reading Flash Content now ...
xGPT : Normalize settings Ok!
Brand : alps
ProdName : SSM-1-55-8M
ProdModel : SSM-1-55-8M
Device : SSM-1-55-8M
AndroidVer: 6.0
MTKxCPU : MT6737M
MTKxPRJ : alps-mp-m0.mp1-V2.84_len6737m.35g.m0_P68
[Read Ok] : preloader_ww822_37m_35g_m0.bin
[Read Ok] : lk.bin
[Read Ok] : boot.img
[Read Ok] : recovery.img
[Read Ok] : logo.bin
[Read Ok] : secro.img
[Read Ok] : tz1.img
[Read Ok] : tz2.img
[Read Ok] : system.img
[Read Ok] : cache.img
[Read Ok] : userdata.img
[ScatCFG] : MT6737M / V1.1.2 / ww822_37m_35g_m0 / EMMC
Android Info saved
MAUI Meta DB saved
HWConfig Info saved
FW Size : 1516 MiB
Scatter saved to : C:\Users\GSM YOUSUF\Desktop\MT6737M__alps__SSM-1-55-8M__SSM-1-55-8M__6.0__alps-mp-m0.mp1-V2.84_len6737m.35g.m0_P68\
All done!
Done!
Elapsed: 00:05:32
Reconnect Power/Cable!
Thursday, 21 October 2021
OPPO A3S CPH1853 DUMP FIRMWARE FILE UFI BOX FULL DUMP FILE
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x04, serial number: 0xE1D9AA4C
Manufacturing date: Feb 2019
CID: 15010051 4536334D 4204E1D9 AA4C2660
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
CPH1853A3S
OPPO A3S CPH1803 DUMP FIRMWARE FILE UFI BOX FULL DUMP FILE
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8842-5443
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x03, serial number: 0x7D4D06ED
Manufacturing date: Aug 2018
CID: 15010051 4536334D 42037D4D 06ED85C4
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 176805]
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
CPH1803
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1803
brand: OPPO, model: CPH1803 (OPPO A3s)
build model list: CPH1803 (OPPO A3s)
build id: OPM1.171019.026, version: 8.1.0 [Oreo] (CPH1803EX_11_A.34)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20210122.143520 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb (BGA221)
OPPO A53 CPH 2137 DUMP FILE EMCP UFI BOX FULL FILE
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8842-5443
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x328A84FB
Manufacturing date: Mar 2020
CID: 90014A68 42386150 3E03328A 84FB37E2
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 7943]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
crypto state: encrypted?
eMMC selected: [HYNIX] H9TQ27ADFTMCUR/32GB (BGA221)
cph2137
OPPOV AX7 CPH1903 DUMP FIRMWARE FILE UFI BOX
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x8761AC47
Manufacturing date: Oct 2018
CID: 15010047 5036424D 42018761 AC47A5E8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
CPH1903
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1903
brand: OPPO, model: CPH1903 (OPPO AX7)
build model list: CPH1903 (OPPO AX7)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1903EX_11_A.26)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20201013.205032 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G