google logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logogoogle logo

Thursday 21 October 2021

OPPO A53 CPH 2137 DUMP FILE EMCP UFI BOX FULL FILE

 Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8842-5443

 Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 24MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x90 (SK Hynix)

 Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x328A84FB

 Manufacturing date: Mar 2020

CID: 90014A68 42386150 3E03328A 84FB37E2

CSD: D0270032 8F5903FF FFFFFFEF 8E400042

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 16 MiB [Provisioned, counter: 7943]

 User area: 29.12 GiB(31,268,536,320 bytes)

Cache size: 2 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00

crypto state: encrypted?

eMMC selected: [HYNIX] H9TQ27ADFTMCUR/32GB  (BGA221)

cph2137


 

No comments:

Post a Comment